Effects of Surface Contaminants on Bonding Strength for Direct Cu-Cu Bonding With Passivation Layer
- Resource Type
- Conference
- Authors
- Petillot, Alaric-Yohei Kawai; Shoji, Shuichi; Kawarada, Hiroshi; Mizuno, Jun
- Source
- 2023 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2023 International Conference on. :31-32 Apr, 2023
- Subject
- Communication, Networking and Broadcast Technologies
Components, Circuits, Devices and Systems
Photonics and Electrooptics
Power, Energy and Industry Applications
Signal Processing and Analysis
Gold
Costs
Surface contamination
Semiconductor device manufacture
Packaging
Bonding
Carbon
VUV
Plasma treatment
Surface contaminants
Cu bonding
- Language
Cu bonding with an addition of an interfacial layer has been gaining attention for providing low-temperature bonding solutions for direct Cu bonding in advanced packaging. In this paper, Cu surfaces with an Au passivation layer were exposed to various dry surface treatments and analyzed by XPS to understand the effects of carbon contaminants on bonding strength. We have shown that VUV N2 treated samples improved the bonding strength and yield significantly compared to the bare samples as various carboxyl and carbonyl groups were removed from the bonding interface.