DBC Technology for Extremely Thin Flat Heat Pipes
- Resource Type
- Conference
- Authors
- Kamenova, L.; Avenas, Y.; Schaeffer, Chr.; Tzanova, S.; Kapelski, G.; Schulz-Harder, J.
- Source
- 2007 IEEE Industry Applications Annual Meeting Industry Applications Conference, 2007. 42nd IAS Annual Meeting. Conference Record of the 2007 IEEE. :1412-1418 Sep, 2007
- Subject
- Power, Energy and Industry Applications
Robotics and Control Systems
Computing and Processing
Thermal conductivity
Electronic packaging thermal management
Copper
Heat transfer
Thermal management
Heat sinks
Conducting materials
Space technology
Bonding
Thermal management of electronics
- Language
- ISSN
- 0197-2618
This paper presents the conception and the experimental procedures of flat copper heat pipe embedded in extremely thin 3D packaging substrates. Since conventional machining for this application is very complicated and expensive, the DBC (Directed Bonded Copper) technology proved to be more interesting for mass production. The experimental results demonstrated that the DBC heat pipe is an excellent solution to enhance the heat transfer within the 3D packaging.