The Design of Wafer Defects Marking System Based on Machine Vision
- Resource Type
- Conference
- Authors
- Zhou, Juan; Jiang, Dengfeng
- Source
- 2010 2nd International Conference on Information Engineering and Computer Science Information Engineering and Computer Science (ICIECS), 2010 2nd International Conference on. :1-3 Dec, 2010
- Subject
- Computing and Processing
Signal Processing and Analysis
Geoscience
Image edge detection
Noise
Maximum likelihood detection
Nonlinear filters
Transforms
Least squares methods
- Language
- ISSN
- 2156-7379
2156-7387
several studies were carried out to improve the efficiency of wafer test based on machine vision. The configuration and work flow of system were introduced and each segment was described. The edge image of wafer was extracted from the preprocessed image of wafer and least square method was adopted to gain the wafer diameter firstly. Then, the coordinate of the wafer defects was got through coordinate transformation, and the coordinate was transferred to the probe machine. Finally, the wafer with defects was eliminated by the probe machine .Experiments show that the system exhibits good performance.