3D Integration for Modular Quantum Computer based on Diamond Spin Qubits
- Resource Type
- Conference
- Authors
- Ishihara, R.; Hermias, J.; Neji, S.; Yu, K. Y.; van der Maas, M.; Nur, S.; Iwai, T.; Miyatake, T.; Miyahara, S.; Kawaguchi, K.; Sato, S.
- Source
- 2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM) Advanced Metallization Conference (MAM)(IITC/MAM), 2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for. :1-3 May, 2023
- Subject
- Components, Circuits, Devices and Systems
Engineered Materials, Dielectrics and Plasmas
Quantum entanglement
Metallization
Qubit
Diamonds
Routing
Optical fiber communication
Large scale integration
Quantum computer
3D integration
Photonic circuits
Flip-chip bonding
- Language
- ISSN
- 2380-6338
Quantum computer chip based on spin qubits in diamond uses modules that are entangled with on-chip optical links. This enables an increased connectivity and a negligible crosstalk and error-rate when the number of qubits increases onchip. Here, 3D integration is the key enabling technology for a large-scale integration of the diamond spin qubits with photonic and electronic circuits for routing, control and readout of qubits. There are several engineering challenges to integrate the large number of spins in diamond with the on-chip circuits operating at a cryogenic temperature. In this paper we will address challenges, present recent results and discuss future outlook of the integration technology for realization of a scalable quantum computer based on diamond spin qubits.