High Speed SerDes Design on FOCoS with Thick RDL
- Resource Type
- Conference
- Authors
- Hung, Li-Chieh; Wu, PO-I; Kuo, Hung-Chun; Jhong, Ming-Fong; Wang, Chen-Chao
- Source
- 2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2020 15th International. :53-55 Oct, 2020
- Subject
- Communication, Networking and Broadcast Technologies
Components, Circuits, Devices and Systems
Computing and Processing
Engineering Profession
Robotics and Control Systems
Copper
Propagation losses
Dielectric losses
Substrates
Conductors
Insertion loss
Strips
- Language
- ISSN
- 2150-5942
Because copper thickness of redistribution layer (RDL) is thinner than normal substrate, the signal loss of fan out chip on substrate (FOCoS) is worse than flip chip ball grid array (FCBGA) for the same trace length. In this paper, FOCoS with different RDL thickness is studied. Will show RDL combines thick and thin copper thickness can effectively reduce RDL transmission loss. We also compare the high speed SerDes eye diagram of different RDL copper thickness. High speed SerDes signals with thicker RDL and thoughtful design can have better eye diagram performance than traditional design.