Automated Dual-probing System for Wafer-level Testing Based on the Integration of Visual Identification and Laser Sensing
- Resource Type
- Conference
- Source
- 2018 IEEE International Conference on Advanced Manufacturing (ICAM) Advanced Manufacturing (ICAM), 2018 IEEE International Conference on. :101-104 Nov, 2018
- Subject
Communication, Networking and Broadcast Technologies Components, Circuits, Devices and Systems Computing and Processing Engineered Materials, Dielectrics and Plasmas Engineering Profession General Topics for Engineers Power, Energy and Industry Applications Robotics and Control Systems Signal Processing and Analysis Sensors Measurement by laser beam Visualization Micromechanical devices Probes Laser feedback Semiconductor device measurement Automated Dual-probing System MEMS measurement MEMS Wafer Test - Language