The efficient placement design for 3D Stacked Dies Packages
- Resource Type
- Conference
- Authors
- Yuan, Zhi-Lung; Huang, Mong-Na Lo; Huang, Yu-Jung
- Source
- 2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2020 15th International. :262-265 Oct, 2020
- Subject
- Communication, Networking and Broadcast Technologies
Components, Circuits, Devices and Systems
Computing and Processing
Engineering Profession
Robotics and Control Systems
Three-dimensional displays
Data models
Solid modeling
Bonding
Crosstalk
Wires
Splines (mathematics)
- Language
- ISSN
- 2150-5942
In this article, vertical interconnection implemented as capacitive-based chip-to-chip differential signaling offers crosstalk noise reduction in three-dimensional (3-D) die stacking. To investigate the effects of signal transmission reliability on the 3-D stacked die structure, this article aims at providing the semi-parametric models. The signal and noise properties of capacitively coupled channels are studied using a 3-D electromagnetic field solver to extract the mixed-mode scattering parameters of the differential signal pads. Corner differential arrangements are considered, and their abilities for frequency-aware placement design are investigated through the proposed semi-parametric models.