A flexible top metal structure to improve ultra low-k reliability
- Resource Type
- Conference
- Source
- 2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM) Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM), 2015 IEEE International. :303-306 May, 2015
- Subject
Components, Circuits, Devices and Systems Engineered Materials, Dielectrics and Plasmas Decision support systems Lead Packaging Microelectronics Reliability - Language
- ISSN
- 2380-632X
2380-6338