Low loss Interconnection Solutions of Chip-to-Antenna for Millimeter-Wave Antenna-in-Package Application
- Resource Type
- Conference
- Authors
- Chu, Chia-Ching; Ho, Cheng-Yu; Hsieh, Sheng-Chi; Wang, Chen-Chao
- Source
- 2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2020 15th International. :64-67 Oct, 2020
- Subject
- Communication, Networking and Broadcast Technologies
Components, Circuits, Devices and Systems
Computing and Processing
Engineering Profession
Robotics and Control Systems
Substrates
Antennas
Transceivers
Antenna arrays
Radio frequency
Integrated circuit interconnections
Radar antennas
Antenna-in-Package Technology (AiP)
low Dk/Df substrate materials
millimeter wave (mmWave)
conductorbacked coplanar waveguide (CBCPW)
interconnection loss
- Language
- ISSN
- 2150-5942
Antenna-in-Package Technology (AiP) is a packaging solution technology for millimeter wave (mmWave) applications, such as automotive radar and 5G communication. AiP designers need to consider aspects such as antennas performance and interconnection loss between RF transceiver and antenna. The interconnection loss seriously affect the performance of the AiP. In this article, the conductor-backed coplanar waveguide (CBCPW) is used to evaluate the interconnection loss of three low Dk/Df substrate materials with different Dk/Df. The frequency band of CBCPW is 10 GHz to 90 GHz. The low Dk/Df substrate material can reduce the interconnection loss at 77 GHz by approximately 61.5%. In summary, designers can optimize AiP performance after reading this article.