SMT GOES GREEN: investigations on an optimization of lead-free solder pastes using wetting tests, solder balling tests, and screen printing tests with simulated process breaks
28th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2005. Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2005. 28th International Spring Seminar on. :167-172 2005
Subject
Components, Circuits, Devices and Systems Surface-mount technology Environmentally friendly manufacturing techniques Lead Printing Electronic equipment testing Circuit testing Manufacturing processes Environmental factors Printed circuits Virtual manufacturing