A novel sample preparation technique for 3D_IC micro-bumps for wider region observation
- Resource Type
- Conference
- Authors
- Han-Yun Long; King-Ting Chiang; Chun-An Huang; Li Chuang; Ming-Lun Chang; Jandel Lin
- Source
- 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2012 7th International. :141-144 Oct, 2012
- Subject
- Components, Circuits, Devices and Systems
Computing and Processing
Engineered Materials, Dielectrics and Plasmas
Fields, Waves and Electromagnetics
Photonics and Electrooptics
Signal Processing and Analysis
Milling
Electromigration
Copper
Reliability
Ion beams
Joints
Electronic components
- Language
- ISSN
- 2150-5934
2150-5942
With the demands of higher multifunctional performance, 3D chips in stacking technology are widely developed recently. But the methods of 3D micro-bumps observation are normally confined to narrow widths. The polished width of either way of FIB or CP method is just able to reach the range of several to hundreds of micrometers. In this study, expanding to 3000 um of polished width is achievable by special sample preparation technique in iST. And the milling result of this system reveals the same quality of cross-section image compared to both FIB and CP methods.