An 84.48 Gb/s CMOS D-band Multi-Channel TX System-in-Package
- Resource Type
- Conference
- Authors
- Hamani, Abdelaziz; Foglia-Manzillo, Francesco; Siligaris, Alexandre; Cassiau, Nicolas; Blampey, Benjamin; Hameau, Frederic; Dehos, Cedric; Clemente, Antonio; Gonzalez-Jimenez, Jose Luis
- Source
- 2021 IEEE Radio Frequency Integrated Circuits Symposium (RFIC) Radio Frequency Integrated Circuits Symposium (RFIC), 2021 IEEE. :207-210 Jun, 2021
- Subject
- Communication, Networking and Broadcast Technologies
Components, Circuits, Devices and Systems
Engineered Materials, Dielectrics and Plasmas
Fields, Waves and Electromagnetics
Wireless communication
Spectral efficiency
Silicon-on-insulator
CMOS technology
Radiofrequency integrated circuits
System-on-chip
Arrays
D-band
high data rate
front-end transmitter
64-QAM
power amplifiers
LO generation
mixer
CMOS 45 nm
- Language
- ISSN
- 2375-0995
This paper presents an in-package D-band wireless module co-integrating an innovative channel bonding transmitter IC in 45 nm CMOS PDSOI technology and a patch antenna fabricated using a low-cost printed circuit board process. The transmitter is composed of two up-conversion chains with dedicated millimeter-wave local oscillator generators and operates over contiguous sub-bands around 147.96 GHz. The two sub-band signals are combined off-chip using a substrate integrated waveguide diplexer and radiated by a four-patch antenna array realized on the same laminate substrate. The total output band spans from 139.3 to 156.6 GHz. A data rate of 84.48 Gb/s is demonstrated using 64-QAM. The radiated power is 3.8 dBm at the output 1 dB compression point. The chip consumes 600 mW from a 1-V voltage supply and occupies a compact area of 4.8mm 2 .