Magnetic Field-Assisted Self-Wound 3-D Nanomembrane Capacitors Bridge the Gap Between MLCC and Trench Capacitor Technologies
- Resource Type
- Periodical
- Authors
- Gabler, F.; Schmidt, O.G.
- Source
- IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 10(7):1251-1254 Jul, 2020
- Subject
- Components, Circuits, Devices and Systems
Engineered Materials, Dielectrics and Plasmas
Windings
Capacitors
Capacitance
Three-dimensional displays
Magnetic fields
Metals
Fabrication
3-D
capacitors
energy storage
magnetostatics
microfabrication
nanotechnology
origami
self-assembly
system integration
thin films
- Language
- ISSN
- 2156-3950
2156-3985
This letter reports the transformation of large-area planar metal–insulator–metal (MIM) nanomembrane capacitors into compact tubular 3-D architectures. By combining the powerful approach of strain-induced nanomembrane self-assembly with an external magnetic field, a stable winding process over a large distance in the range of centimeters is demonstrated. A wet release platform based on encapsulated methyl cellulose allows to release the planar structures with rates of several $100~\mu \text{m}$ /s from their substrate. Footprint shrinkage factors up to 230 are shown by assembling 24-mm long planar structures into 3-D architectures having 82- $\mu \text{m}$ diameter and ~120 windings. The fabricated capacitors feature a capacitance per footprint up to $1.3~\mu \text{F}$ /mm 2 for a 15-nm Al 2 O 3 dielectric with less than 100-nA/ $\mu \text{F}$ leakage at 6 V and improved frequency characteristics. This technology is a promising candidate for bridging the gap between discrete multilayer ceramic capacitor (MLCC) and ON-chip trench capacitor technologies.