Switching-induced substrate noise and mixed-signal receiver design
- Resource Type
- Conference
- Authors
- Frye, R.C.
- Source
- 2000 Southwest Symposium on Mixed-Signal Design (Cat. No.00EX390) Mixed-signal design Mixed-Signal Design, 2000. SSMSD. 2000 Southwest Symposium on. :119-124 2000
- Subject
- Signal Processing and Analysis
Integrated circuit noise
Electronics packaging
Integrated circuit packaging
Noise figure
Stochastic resonance
Impedance
Coupling circuits
Radio frequency
Inductance
Design methodology
- Language
We use a stochastic model of the switching current to describe the power spectral density of current noise waveforms induced by digital switching events. We discuss common impedance paths, particularly arising from non-ideal properties of electronic packages, that couple this noise into the substrate of an integrated circuit. We derive estimates of the noise spectrum for modest digital power and typical package characteristics and evaluate the noise in the context of RF mixed-signal designs. Common TQFP packages show significantly worse noise performance than BGA packages with low inductance substrate ground, and are less suitable for demanding applications. The adoption of differential design methods can eliminate this source of common-mode noise, at the expense of added power or higher noise figure.