Design and packaging for a microelectromechanical thermal switch radiator
- Resource Type
- Conference
- Authors
- Beasley, M.A.; Firebaugh, S.L.; Edwards, R.L.; Keeney, A.C.; Osiander, R.
- Source
- The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (IEEE Cat. No.04CH37543) Thermal and thermomechanical phenomena in electronic systems Thermal and Thermomechanical Phenomena in Electronic Systems, 2004. ITHERM '04. The Ninth Intersociety Conference on. 2:629-634 Vol.2 2004
- Subject
- Computing and Processing
Components, Circuits, Devices and Systems
Engineered Materials, Dielectrics and Plasmas
Signal Processing and Analysis
General Topics for Engineers
Switches
Packaging
Thermal conductivity
Satellites
Biomembranes
Testing
Coatings
Voltage
Thermal engineering
Thermal variables control
- Language
Smaller satellites will require low-power, lightweight thermal control. This paper describes a technology based on a thermal switch which controls the conductivity between the radiator and a highly-emissive surface. The device is going to be tested aboard MIDSTAR 1, a small satellite that is being designed and built by students at the United States Naval Academy. This paper presents a discussion of the device design, and a detailed thermal analysis that shows how the power dissipation for the device relates to design parameters. The package and testing procedure are also described.