Non-contact thermal characterization using IR camera for compact metal-oxide gas sensor
- Resource Type
- Conference
- Authors
- Stoukatch, S.; Fagnard, J.-F.; Dupont, F.; Laurent, P.; Redoute, J.-M.
- Source
- 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2021 IEEE 23rd. :483-487 Dec, 2021
- Subject
- Communication, Networking and Broadcast Technologies
Components, Circuits, Devices and Systems
Engineered Materials, Dielectrics and Plasmas
Photonics and Electrooptics
Power, Energy and Industry Applications
Temperature measurement
Temperature sensors
Heating systems
Sensor phenomena and characterization
Thermal management
Cameras
Electronic packaging thermal management
Non-contact thermal characterization
IR thermography
MOX sensors
thermal management of electronic packaging
microassembly
- Language
Following a demand for thermal management there is need to measure precisely a temperature on the most critical part of microassembly. The widely-used contact type of measurements is often not suitable for micro parts of assembly as small as 0.5 mm and smaller. The non-contact measurements currently available are not always directly applicable on complex heterogeneous microassemblies structures such as miniaturized metal-oxide (MOX) gas sensor. In response to this, we have developed a simple technique using IR thermography for accurate and non-contact temperature measurements of electronic microassemblies, and validate this approach with MOX sensors heated to operating temperature of 250-300°C.