Reliability of Copper Sintered Interconnects Under Extreme Thermal Shock Conditions
- Resource Type
- Conference
- Authors
- Bhogaraju, Sri Krishna; Ugolini, Francesco; Belponer, Federico; Greci, Alessio; Elger, Gordon
- Source
- 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC) Microelectronics and Packaging Conference & Exhibition (EMPC), 2023 24th European. :1-5 Sep, 2023
- Subject
- Aerospace
Bioengineering
Components, Circuits, Devices and Systems
Photonics and Electrooptics
Power, Energy and Industry Applications
Transportation
Sintering
Thermal shock
Conductivity
Thermal conductivity
Reliability
Copper
Bonding
sintering
copper flakes
reliability
SiC
die-attach
- Language
Copper flakes-based sinter paste showed high reliability under thermal shock conditions. A dense and homogeneous interconnect was realized while sintering for 5 min at 275°C under 15 MPa bonding pressure, with the flakes showing the unique behavior of stacking over each other to realize a dense and homogeneous interconnect. Porosity under 10 % could be achieved. The paste could be sintered under a constant nitrogen flow and did not need a fully inert atmosphere during sintering. Under high stress thermal shock cycling of + 175/-65°C, the sintered interconnects showed a drop of 25% in the shear strength values after 1000 TST, consistent with observations made with Ag sintering. Thermal conductivity more than 200 W/mK and electrical conductivity of 20 Ms/m is achieved using the Cu sinter paste.