Fabrication and packaging of a miniature sensor array for harsh environments
- Resource Type
- Conference
- Authors
- Dijkstra, E.A.; Olthuis, W.; Bomer, J.G.; Bergveld, P.; Kronemeijer, D.A.
- Source
- 2001 Microelectromechanical Systems Conference (Cat. No. 01EX521) Microelectromechanical systems conference Microelectromechanical Systems Conference, 2001. :14-17 2001
- Subject
- Components, Circuits, Devices and Systems
Engineered Materials, Dielectrics and Plasmas
Sensor arrays
Fabrication
Packaging
Temperature sensors
Conductivity
Chemical sensors
Petroleum
Pipelines
Powders
Mechanical sensors
- Language
This paper describes the fabrication of devices to be used in harsh environments. The devices should operate under extreme conditions: high temperature (180/spl deg/C), high pressure (200 bar) and in a chemically aggressive environment. Therefore, packaging is a major concern. Sensor fabrication and packaging is described. Two devices were made and tested at the temperature and pressure mentioned above.