This study presents the development and performance of a half bride insulated-gate bipolar transistor planar power module integrated with a turbulent water cooler for double side direct substrate cooling. A holistic approach which simultaneously overcomes the mechanical, electrical and thermal limitations as well as the inefficient manufacturing of conventional power modules has been employed. Work includes the design consideration in terms of packaging structure, materials and bonding technologies; three-dimensional finite element static electric simulation to spot locations with the highest electrical potential gradient, electromagnetic simulation to extract the parasitic inductances of commutation loops, thermal and computational fluid dynamics co-simulation to predict the cooling performance of the integrated turbulent water cooler; assembling processes and technologies to prototype the design module; and static electrical and double pulse tests to verify the electrical functions, and thermal test to validate the cooling performance. All the results obtained can be used to demonstrate cost effective manufacturing, desirable mechanical, electrical and thermal performance and potential improvement of the designed and prototyped planar power module.