Packaging for fast switching power electronics
- Resource Type
- Conference
- Authors
- Marchant, Stewart; Dai, Jingru; Mouawad, Bassem; Empringham, Lee; Clare, Jon
- Source
- 2023 IEEE 8th Southern Power Electronics Conference and 17th Brazilian Power Electronics Conference (SPEC/COBEP) Power Electronics Conference and 17th Brazilian Power Electronics Conference (SPEC/COBEP), 2023 IEEE 8th Southern. :1-6 Nov, 2023
- Subject
- Power, Energy and Industry Applications
Fabrication
Inductance
Switches
Packaging
Thermal conductivity
Electronic packaging thermal management
Power electronics
PCB embedding
fast switching
low inductance packaging
wide bandgap
GaN
Q3D extractor
- Language
- ISSN
- 2832-2983
This work investigates printed circuit board embedding of the power devices in order to support low inductance, fast switching package designs. The embedding process is discussed and a half bridge package is designed around a 500V supply voltage and a 40A operating current using bare gallium nitride dies. Parasitic extraction from the computer aided design model predicted a commutation loop inductance of 1.95nH. The package was manufactured but the initial result was found not to function electrically. Misalignment between two of its component parts during fabrication was identified as the most likely cause. A solution to the fabrication problem was devised and tested. It is intended that an electrically functional package will be produced in the future.