A comparison of heat sink geometries for laminar forced convection: Numerical simulation of periodically developed flow
- Resource Type
- Conference
- Authors
- Behnia, M.; Copeland, D.; Soodphakdee, D.
- Source
- ITherm'98. Sixth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.98CH36208) Thermal and thermomechanical phenomena in electronic systems Thermal and Thermomechanical Phenomena in Electronic Systems, 1998. ITHERM '98. The Sixth Intersociety Conference on. :310-315 1998
- Subject
- Computing and Processing
Components, Circuits, Devices and Systems
Engineered Materials, Dielectrics and Plasmas
Signal Processing and Analysis
General Topics for Engineers
Heat sinks
Geometry
Numerical simulation
Thermal resistance
Heat transfer
Electronics cooling
Resistance heating
Electronic packaging thermal management
Surface resistance
Virtual manufacturing
- Language
In this study, we have attempted to compare the heat transfer performance of various commonly used fin geometries. Realistic, manufacturable geometries are optimized for minimization of thermal resistance at moderate laminar air velocities. The basis of comparison was chosen to be a circular array of 1 mm diameter pin fins with a 2 mm pitch. The pitch-to-width ratio of the other geometries were chosen to provide equal ratios of fin area to base area. CFD simulations were carried out in a two-dimensional computational domain bounded by planes of symmetry parallel to the flow. The air velocity was in the range of 0.5 to 5 m/s. A comparison of heat transfer coefficients and pressure drops is presented.