Measurement of vapor chamber performance [heatsink applications]
- Resource Type
- Conference
- Authors
- Wei, J.; Chan, A.; Copeland, D.
- Source
- Ninteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium, 2003. Semiconductor thermal measurement and management Semiconductor Thermal Measurement and Management Symposium, 2003. Ninteenth Annual IEEE. :191-194 2003
- Subject
- Components, Circuits, Devices and Systems
Engineered Materials, Dielectrics and Plasmas
Water heating
Heat sinks
Temperature
Power dissipation
Microprocessors
Aluminum
Copper
Manufacturing systems
Systems engineering and theory
Laboratories
- Language
- ISSN
- 1065-2221
The thermal behavior of a vapor chamber with water as the working fluid and sintered metal particles for a wick structure has been experimentally determined. Results are provided in two formats - as traditional heat flux versus temperature difference (due to boiling) and as film coefficient versus heat flux. Results show that the film coefficient increases with heat flux in an approximately linear trend. The critical heat flux has not been determined due to equipment limitations. The maximum heat flux measured is 80 W/cm/sup 2/. An example case study is included to illustrate the use of correlated results to estimate vapor chamber heatsink performance, as well as to compare with the performance of metal based heatsinks.