Flexible Hybrid Electronics on Wearable Healthcare Application
- Resource Type
- Conference
- Authors
- Chen, Ming-Hung; Chang, Wei-Hao; Pi, Tun-Ching; Lee, Wei-Chun; Kao, Jen-Chieh; Yeh, Yung-I
- Source
- 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC) Microelectronics and Packaging Conference & Exhibition (EMPC), 2023 24th European. :1-5 Sep, 2023
- Subject
- Aerospace
Bioengineering
Components, Circuits, Devices and Systems
Photonics and Electrooptics
Power, Energy and Industry Applications
Transportation
Temperature measurement
Flexible printed circuits
Electrocardiography
Real-time systems
Wearable devices
Biomedical monitoring
Monitoring
Flexible Hybrid Electronics (FHE)
System-in-Package (SiP)
Electrocardiography (ECG)
Patch
- Language
24/7 real-time body signal monitoring for decease check and life quality enhancement is becoming a megatrend these years. However, the precious yet limited clinical facility and medical professionals cannot fulfill the emerging needs out-of-hospital. A wearable device such like smart watch utilizing biosensor-integrated System-in-Package (SiP) module can provide a real time and personal-based bio data collection as well as better health management through AI assistance. For performing a more comfortable experience, flexible hybrid electronics with ECG SiP embedded was proposed with lower profile and higher structure flexibility. The patch durability by 100,000 times rolling test as simulating daily use condition was also examined.