The Shift-Left Die Strength Analysis Method for Memory Die Products
- Resource Type
- Conference
- Authors
- Liu, Vance; Wang, Yi-Chen; Tsai, Cyane; Chen, Jeremy; Leong Gan, Chong; Bansal, Raj; Takiar, Hem
- Source
- 2022 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2022 International Conference on. :201-202 May, 2022
- Subject
- Components, Circuits, Devices and Systems
Computing and Processing
Engineered Materials, Dielectrics and Plasmas
Fields, Waves and Electromagnetics
Photonics and Electrooptics
Power, Energy and Industry Applications
Robotics and Control Systems
Signal Processing and Analysis
Transportation
Analytical models
Shape
Linear regression
Silicon
Data models
Load modeling
Electronics packaging
4-point bending
die strength
beam theory
Weibull Analysis
assembly
- Language
This study is aimed to make 4-point bend die strength analysis be more suitable for different memory die shape products comparison. The die strength analysis discussed in the research is a shift-left and predictive method when dealing with heterogeneous material at a thin thickness in the design of experiment phase. The result exhibits a high R square value, and is also a decent manner to interpolate and predict the maximum load of memory dies in coverage of different die thicknesses.