Miniaturized LTE modem SiP using novel multiple compartments shielding
- Resource Type
- Conference
- Authors
- Leou, JL; Chen, Vincent; Chen, JJ; Wang, Thomas; Chang, Harrison
- Source
- IEEE CPMT Symposium Japan 2014 CPMT Symposium Japan (ICSJ), 2014 IEEE. :51-54 Nov, 2014
- Subject
- Bioengineering
Communication, Networking and Broadcast Technologies
Components, Circuits, Devices and Systems
Computing and Processing
Engineered Materials, Dielectrics and Plasmas
Fields, Waves and Electromagnetics
Photonics and Electrooptics
Radio frequency
Modems
Metals
Sensitivity
Transceivers
Performance evaluation
Substrates
Shielding
LTE
CPS
RF Design
- Language
- ISSN
- 2373-5449
This paper describes a miniaturized LTE SiP modem target for the smallest form factor among the product category. A Novel compartment shielding process is used to implement multiple shielded areas to reduce the interference between digital, analog and RF circuits. The result shows that this modem has excellent RF performance and meets all 3GPP LTE Category 3 (downlink speed can reach 100Mbps) and carrier's requirements. This SiP module passed FCC and CE EMI regulatory tests, and also passed GCF and PTCRB certification. Also, the reliability test shows this process meets consumer applications such as LTE modem for tablet. It is found that this compartment shielding process is good for consumer grade SiP module both in technology and in commercial terms.