Test and verification of micro coaxial line power performance
- Resource Type
- Conference
- Authors
- Ralston, Parrish; Vanhille, Kenneth; Caba, Aaron; Oliver, Marcus; Raman, Sanjay
- Source
- 2012 IEEE/MTT-S International Microwave Symposium Digest Microwave Symposium Digest (MTT), 2012 IEEE MTT-S International. :1-3 Jun, 2012
- Subject
- Photonics and Electrooptics
Fields, Waves and Electromagnetics
Assembly
Transmission line measurements
Testing
Power transmission lines
Conductors
Temperature measurement
Microwave circuits
Coaxial transmission lines
high power transmission lines
air dielectric
PolyStrata
- Language
- ISSN
- 0149-645X
This paper presents the characterization of rectangular micro-coaxial transmission lines assembled in a high power test system. In addition to straight transmission lines, vertical solder transitions between stacked layers of rectangular coax are presented. These test assemblies utilize standard integration techniques and components: wire bond and flip-chip transitions and edge coaxial connectors. Assembled coax lines were tested at continuous wave power levels as high as 200 W at a frequency of 2 GHz. High frequency performance of the test assemblies is maintained throughout high power testing. Thermal models developed using a 3-D finite element method are utilized to understand limitations of micro-coaxial transmission lines at higher frequencies.