A bonding alternative to silicone adhesives for solar cell integration has been explored. Efficacy and performance of traditional silicone adhesives is limited by manufacturability and UV degradation. A new method, utilizing deep eutectic solvents (DESs) been shown to mitigate obstacles inherent to silicone adhesives. The eutectic and ionic nature of DESs allows for freezing point depression and dissolution of metal oxides, creating a low temperature, graded, spinel-like structure when isothermally heated. This technique offers improved fracture toughness, strength, and UV exposure tolerance while preserving the optical and electrical properties of the cell. Understanding the structure and properties of the DES material is necessary for chemical manipulation and bond stability. In this study, the DESs and bond layers were examined using inductively coupled plasma-mass spectroscopy, optical microscopy, x-ray diffraction, and differential scanning calorimetry. Solubility of metal oxides in the DES are reported, the bond structures imply miscibility, and 0optimized bond behavior was achieved with the addition of hydrochloric acid to the DES.