Determining Mechanical Stress Testing Parameters for FHE Designs with Low Computational Overhead
- Resource Type
- Periodical
- Authors
- Bhat, G.; Gao, H.; Mandal, S.K.; Ogras, U.Y.; Ozev, S.
- Source
- IEEE Design & Test IEEE Des. Test Design & Test, IEEE. 37(4):35-41 Aug, 2020
- Subject
- Computing and Processing
Components, Circuits, Devices and Systems
Stress
Flexible electronics
Performance evaluation
Testing
Integrated circuits
Fault location
Flexible hybrid electronics
test
COMSOL Multiphysics
stress
integer linear programming
- Language
- ISSN
- 2168-2356
2168-2364
Flexible hybrid electronics have complex mechanical stress failure mechanisms. Researchers from ASU propose a novel method to obtain the optimum set of mechanical stress patterns to cover all potential fault locations and exert the required mechanical stress as dictated by the application.— Vivek Chickermane, Cadence Design Systems