A Sub-500fJ/bit 3D Direct Bond Silicon Photonic Transceiver in 12nm FinFET
- Resource Type
- Conference
- Authors
- Chang, Po-Hsuan; Samanta, Anirban; Yan, Peng; Fu, Mingye; Zhang, Yu; On, Mehmet Berkay; Kumar, Ankur; Kang, Hyungryul; Yi, Il-Min; Annabattuni, Dedeepya; Scott, David; Patti, Robert; Fan, Yang-Hang; Zhu, Yuanming; Ben Yoo, S. J.; Palermo, Samuel
- Source
- 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) VLSI Technology and Circuits (VLSI Technology and Circuits), 2023 IEEE Symposium on. :1-2 Jun, 2023
- Subject
- Components, Circuits, Devices and Systems
Three-dimensional displays
Sensitivity
Very large scale integration
Wavelength division multiplexing
Silicon photonics
FinFETs
Transceivers
- Language
- ISSN
- 2158-9682
This paper presents an energy-efficient electronic-photonic co-designed transceiver heterogeneously 3D-integrated with high-density, low-parasitic direct bond interconnect (DBI ® ) featuring 32-channel silicon photonic microdisk modulator/filter based optical transceivers in 12nm FinFET for wavelength division multiplexing (WDM). The transmitter has $1.2\mathrm{V}_{ppd}$ electrical modulation swing and 7dB extinction ratio. The receiver achieves an OMA sensitivity of -18.82dBm at 18Gb/s. The transceiver pair at 18Gb/s achieves 496fJ/bit energy efficiency. The receiver can further operate at 25Gb/s with -16.9dBm OMA and 227fJ/bit efficiency.