A Direct Bond Interconnect 3D Co-Integrated Silicon-Photonic Transceiver in 12nm FinFET with -20.3dBm OMA Sensitivity and 691fJ/bit
- Resource Type
- Conference
- Authors
- Samanta, Anirban; Chang, Po-Hsuan; Yan, Peng; Fu, Mingye; Berkay-On, Mehmet; Kumar, Ankur; Kang, Hyungryul; Yi, Il-Min; Annabattuni, Dedeepya; Zhang, Yu; Scott, David; Patti, Robert; Fan, Yang-Hang; Zhu, Yuanming; Palermo, Samuel; Ben Yoo, S.J.
- Source
- 2023 Optical Fiber Communications Conference and Exhibition (OFC) Optical Fiber Communications Conference and Exhibition (OFC), 2023. :1-3 Mar, 2023
- Subject
- Communication, Networking and Broadcast Technologies
Photonics and Electrooptics
Three-dimensional displays
Sensitivity
Integrated circuit interconnections
Packaging
Optics
FinFETs
Transceivers
- Language
We present the first experimental demonstration of an electronic-photonic co-designed transceiver circuit heterogeneously 3D co-integrated with high-density, low-parasitic Direct Bond Interconnect (DBI ® ) featuring full SerDes that achieves -20.3dBm OMA sensitivity and 691fJ/bit link energy efficiency.