Characterization of Optical Redistribution Loss Developed for Co-Packaged Optics
- Resource Type
- Periodical
- Authors
- Noriki, A.; Tamai, I.; Ibusuki, Y.; Ukita, A.; Suda, S.; Takemura, K.; Shimura, D.; Onawa, Y.; Yaegashi, H.; Amano, T.
- Source
- IEEE Photonics Technology Letters IEEE Photon. Technol. Lett. Photonics Technology Letters, IEEE. 34(17):899-902 Sep, 2022
- Subject
- Engineered Materials, Dielectrics and Plasmas
Photonics and Electrooptics
Optical waveguides
Optical device fabrication
Silicon
Optical fibers
Mirrors
Optical polymers
Optical coupling
Co-packaged optics
micro mirror
optical redistribution
polymer waveguide
silicon photonics
- Language
- ISSN
- 1041-1135
1941-0174
We previously proposed a new package substrate called active optical package (AOP) substrate to realize co-packaged optics. An optical redistribution technology on silicon photonics dies was developed to fabricate the AOP substrate. It is composed of a polymer waveguide, with a mirror-based optical coupling between the polymer and silicon waveguides. The fabricated optical redistribution loss was characterized in this study. An average loss of approximately 4 dB and wavelength dependent loss of ±1 dB were observed for the wavelength range of 1460–1600 nm. It was shown that the low wavelength-dependent optical redistribution was available owing to the broadband characteristics of mirror-based optical coupling and polymer waveguide.