Antenna on Silicon Interconnect Fabric
- Resource Type
- Conference
- Authors
- Dasgupta, Arpan; Alam, Arsalan; Ouyang, Guangqi; Jangam, SivaChandra; Iyer, Subramanian S.
- Source
- 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2020 IEEE 70th. :1788-1794 Jun, 2020
- Subject
- Components, Circuits, Devices and Systems
Antennas
Substrates
Silicon compounds
Silicon
Fabrication
Fabrics
Resists
Antenna in Package
Silicon Interconnect Fabric
Fused Silica
PDMS
- Language
- ISSN
- 2377-5726
In this paper we demonstrate a 20 GHz patch antenna on the Silicon-Interconnect Fabric (Si-IF) platform. Two methodologies to integrate the antenna are explored in this paper. One is to embed a Fused Silica die inside a recess etched on the Si-IF. The second method is to compression mold Polydimethylsiloxane (PDMS) into the Si-IF recess. The antennas fabricated with both the methods are compatible with Ground- Signal-Ground (GSG) probing, and interfacing with off the shelf MMIC dies. Along with the process flow, we also present experimental characterisation of the fabricated antennas.