Thermomechanical Behavior of Micron Scale Solder Joints: An Experimental Observation
- Resource Type
- article
- Source
- Journal of the Mechanical Behavior of Materials, Vol 10, Iss 3, Pp 135-146 (1999)
- Subject
Mechanical engineering and machinery TJ1-1570 - Language
- English
- ISSN
- 0334-8938
2191-0243