ANALYSIS OF THE INFLUENCE OF SOP LEAD SHAPE ON SOLDER JOINT RELIABILITY
- Resource Type
- article
- Authors
- REN Chao; SHAO Jiang; ZENG ChenHui; XUE HePing
- Source
- Jixie qiangdu, Vol 38, Pp 591-595 (2016)
- Subject
- Lead shape
Finite element method
Small outline package(SOP)
Reliability
Mechanical engineering and machinery
TJ1-1570
Materials of engineering and construction. Mechanics of materials
TA401-492
- Language
- Chinese
- ISSN
- 1001-9669
3-D finite element models of SOP( Small Outline Package) were constructed,in which Anand visco-plasticity constitutive equation was used to describe the mechanic behavior of solder joint. The solder joint deformation and stress distribution with five kinds of lead shapes were researched. The experimental program for the identification of numerical simulation was performed with three kinds of lead shapes. Both experimental and simulation results showed that the solder joint life is closely related with lead shape. The lead shape with low stiffness can decrease the stress apparently. With decreasing the bending radius or increasing the standoff height,the component reliability will be enhanced. The numerical simulation result was congruous with experimental testing data,can able to reflect the factual behavior of SOP accurately.