树脂塞孔研磨过程中镀覆孔拐角露铜的探究 / Study on copper exposure at the corner of plated hole by grinding process of resin plug hole
- Resource Type
- Academic Journal
- Source
- 印制电路信息 / Printed Circuit Information. 30(2):10-14
- Subject
树脂塞孔;金属化孔;拐角铜厚 - Language
- Chinese
- ISSN
- 1009-0096