纳米银焊膏贴装片式电阻的可靠性研究 / Study on Reliability of Chip Resistor Mounted with Nano-Silver Solder Paste
- Resource Type
- Academic Journal
- Source
- 电子与封装 / Electronics and Packaging. 23(8):24-29
- Subject
纳米银焊膏 片式电阻 环境可靠性 显微组织 力学性能 nano-silver solder paste chip resistor environmental reliability microstructure mechanical properties - Language
- Chinese
- ISSN
- 1681-1070