有机可焊保护剂出现不溶物的原因分析及改进 / Reason analysis on insolubles formed in organic solderability preservative and corresponding improvement measures
- Resource Type
- Academic Journal
- Source
- 电镀与涂饰 / Electroplating & Finishing. 41(1):62-66
- Subject
印制电路板;有机可焊保护剂;不溶物;双酰胺;催化剂 - Language
- Chinese
- ISSN
- 1004-227X