[目的]通过对半导体产业最基础的晶圆制备技术进行学术研究,梳理其发展现状和发展趋势,并分析该领域中专利布局的现状和趋势.[方法]采用文献综述的方法,并对相关专利文献进行分析.[结果]结果表明,晶圆制造过程涉及多道工艺步骤,包括单晶硅的生长、晶圆切割、去除杂质、刻蚀、光刻等.在专利布局方面,当前的中国在晶圆制造技术方面的优势和劣势都比较突出.[结论]晶圆制备技术将持续不断地发展,并成为推动微电子行业发展的重要力量.
[Purposes]This paper sorts out state of development and trends of development and analyzes state of art and trends of patent layouts in field by performing academic studies on most fundamental wa-fer preparation techniques in semiconductor industry.[Methods]The literature review method is adopted in this paper,and relevant patent documents are analyzed.[Findings]The results show that the wafer manufacturing process involves multiple process steps,including the growth of single crystal silicon,wa-fer cutting,impurity removal,etching,and photolithography.In terms of patent layout,China's advan-tages and disadvantages in wafer manufacturing technology are both prominent.[Conclusions]Wafer preparation technology will continue to develop and become an important force driving the development of the microelectronics industry.