浅谈超导量子比特封装与互连技术的研究进展 / Progress in Superconducting Quantum Bit Packaging and Interconnection Technology
- Resource Type
- Academic Journal
- Source
- 电子与封装 / Electronics and Packaging. 23(10):43-51
- Subject
超导量子计算机 超导量子比特 三维集成封装 高密度互连 superconducting quantum computer superconducting quantum bit 3D packaging high-density interconnection - Language
- Chinese
- ISSN
- 1681-1070