封装器件多应力叠加失效仿真分析与验证 / Failure Simulation Analysis and Verification of the Package Device Under Multiple Stress Superposition Situation
- Resource Type
- Academic Journal
- Source
- 电子与封装 / Electronics and Packaging. 22(2):31-37
- Subject
DIP封装器件;多工况;应力叠加;失效分析 - Language
- Chinese
- ISSN
- 1681-1070