LTCC基板BGA互连失效分析及影响要素识别 / Failure Mechanism Analysis and Influencing Factors Identification of Board Level BGA Interconnect for LTCC Packaging
- Resource Type
- Academic Journal
- Source
- 电子工艺技术 / Electronics Process Technology. 41(2):71-98
- Subject
BGA LTCC 失效模式 故障树分析 田口方法 - Language
- Chinese
- ISSN
- 1001-3474