We report a novel tensile testing device that maintains a deformation even after a load applied to extend a specimen is removed. The device is based on a compliant mechanism with a deformable frame, up and down springs, and two parallel beams to directly apply a force to the specimen. Two markers are included in the device to give the displacement, from which the strain and stress ate obtained it. This device uses a ratchet-like structure as the mechanism to maintain deformation even after the load is removed. From the results of the analysis of the device, we obtained a strain of 1.1 % and a stress ratio of 1.03, in agreement with the expected values. The device utilizes an SOI wafer and the Bosch process.