Plastic Packaged High Linearity Low Noise Amplifier for 12-30GHz Multi-band Telecom Applications
- Resource Type
- Authors
- Sylvie Tranchant; Estelle Byk; Pierre Quentin; Marc Camiade
- Source
- 2006 IEEE MTT-S International Microwave Symposium Digest.
- Subject
- Engineering
Noise measurement
business.industry
Frequency band
Electrical engineering
High-electron-mobility transistor
Integrated circuit packaging
Quad Flat No-leads package
business
Noise figure
Telecommunications
Low-noise amplifier
Monolithic microwave integrated circuit
- Language
The packaged MMIC design and measured performance of a High Linearity and Low Noise Amplifier from 12 to 30GHz are reported in this paper. A mature 0.25 ?m gate length Low Noise Pseudomorphic HEMT technology has been used with a BCB-based protection allowing easy and high reliability chip integration into plastic packages. A standard plastic QFN SMD package has been successfully used : 25dB typical gain has been measured with less than 2.0 dB noise figure in all the frequency band from 12 to 30GHz and more than 26dBm Output IP3 has been measured in the 18-26GHz frequency band.