Resistance and electromigration performance of 6 nm wires
- Resource Type
- Source
- 2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC).
- Subject
010302 applied physics Interconnection Materials science business.industry 020209 energy Electrical engineering chemistry.chemical_element 02 engineering and technology 01 natural sciences Electromigration Copper Line (electrical engineering) Reliability (semiconductor) Electrical resistance and conductance chemistry 0103 physical sciences 0202 electrical engineering, electronic engineering, information engineering Electrical performance Optoelectronics business Lithography - Language