Manufacturing and characterization of Sn–Cu/SiO2np lead-free nanocomposite solder by accumulative roll bonding (ARB) process
- Resource Type
- Source
- Journal of Materials Science: Materials in Electronics. 33:13516-13530
- Subject
Electrical and Electronic Engineering Condensed Matter Physics Atomic and Molecular Physics, and Optics Electronic, Optical and Magnetic Materials - Language
- ISSN
- 1573-482X
0957-4522