Modular packaging concept for MEMS and MOEMS
- Resource Type
- Authors
- Vanessa Stenchly; Wolfgang Reinert; Hans-Joachim Quenzer
- Source
- Journal of Physics: Conference Series. 922:012015
- Subject
- Microelectromechanical systems
History
Materials science
business.industry
02 engineering and technology
Modular design
021001 nanoscience & nanotechnology
01 natural sciences
Computer Science Applications
Education
010309 optics
0103 physical sciences
0210 nano-technology
business
Computer hardware
- Language
- ISSN
- 1742-6596
1742-6588