Front-End Electronics for BM@N STS
- Resource Type
- Authors
- Dmitrii Dementev; I. Kudryashov; I. Kovalev; A. A. Voronin; A. Kurganov; M. Shitenkov; Yu. Murin
- Source
- Physics of Particles and Nuclei. 52:826-829
- Subject
- Physics
Nuclear and High Energy Physics
Test bench
business.industry
Tracking system
Front end electronics
Microstrip
Application-specific integrated circuit
Stack (abstract data type)
Test algorithm
Hardware_INTEGRATEDCIRCUITS
Electronics
business
Computer hardware
- Language
- ISSN
- 1531-8559
1063-7796
The core component of the silicon tracking system (STS) of the BM@N experiment at NICA is a module of CBM STS type. It consists of state-of-the-art components developed for the CBM project at FAIR: a double-sided microstrip silicon sensor, stack of low-mass micro-cables and two front-end boards (FEBs) for the readout of the P- and N-sides of the sensor. New PCB designs for the two geometries of FEBs were developed to fulfill integrational requirements of the BM@N STS project and connectivity scheme. Front-end electronics of the STS is based on STS-XYTER ASIC. Dies are installed on the PCB with a wire-bonding technology which is used due to a high density of components on the FEB. Before the module assembly all ASICs are tested and certified in a special Pogo-pin test circuit. Test algorithm for the characterization of the analog part of the STS-XYTER ASIC was developed and tested for one STS-XYTER ASIC on the FEB and will be implemented for the test bench with Pogo-pin test circuit.