Decreased Deformation and Heat as well as Improved Interface and Diffusion of Silicon To Enhance Electrochemical Performance and Safety by a Negative Thermal Expansion Material.
- Resource Type
- Article
- Source
- Journal of Physical Chemistry C; 8/4/2022, Vol. 126 Issue 30, p12370-12382, 13p
- Subject
- Language
- ISSN
- 19327447