Evaluation of the influence of Bi and Sb additions to Sn-Ag-Cu and Sn-Zn alloys on their surface tension and wetting properties using analysis of variance - ANOVA.
- Resource Type
- Article
- Authors
- K. Bukat; J. Sitek; R. Kisiel; Z. Moser; W. Ga?sior; M. Koscielski; J. Pstrus
- Source
- Soldering & Surface Mount Technology; Sep2008, Vol. 20 Issue 4, p9-19, 11p
- Subject
- ANTIMONY
BISMUTH
ALLOY analysis
WETTING
SURFACE tension
COPPER alloys
SILVER alloys
ANALYSIS of variance
SUBSTRATES (Materials science)
TAGUCHI methods
- Language
- ISSN
- 09540911
The article presents a study on the influence of particular elements antimony (Sb) and bismuth (Bi) when added to tin-silver-copper (Sn-Ag-Cu) and tin-zinc (Sn-Zn) alloys on their interfacial and surface tensions. It also examines the wetting properties on the substrate of Cu substrate expressed through wetting angle. The study utilizes orthogonal Taguchi array and analysis of variance (ANOVA). The study shows that compositions of the alloys do not have the optimal compositions for practical application. The study suggests that tendency of the interfacial and surface tension changes is not correlated with the Cu substrate wettings.