The effects of copper additives on the quantity and cell viability of adherent Staphylococcus epidermidis in silicone implants.
- Resource Type
- Article
- Source
- Biofouling; 2010, Vol. 26 Issue 3, p359-365, 7p, 1 Color Photograph, 1 Black and White Photograph, 3 Graphs
- Subject
SILICONES COPPER STAPHYLOCOCCUS epidermidis INFECTION ANTIBACTERIAL agents BACTERIAL cells - Language
- ISSN
- 08927014